Intel Socket 1151 v2

Listed since: 2019-01-11, manufacturer: ASUS, USB nomenclature: Link, Wireless: not available, Socket: Intel 1151 v2, Warranty: three years (handlin, Graphics: iGPU, Form factor: µATX, Buttons/Switches: not available, Power connections: 1x 24-Pin ATX, 1x 8-, Header Cooling: 1x CPU fan 4-Pin, 1x, Multi-GPU: not available, Header Lighting: not available, Audio: 7.1 (Realtek ALC887), Lighting: orange, 1 zone (Audi, Extension slots: 1x PCIe 3.0 x16, 2x , CPU-Compatibility: Core i-9000, Core i-, RAM: 2x DDR4 DIMM, dual P, Special features: audio+solid capacito, Chipset: Intel B365, External connectors: 1x VGA (iGPU), 1x DV, RAID level: 0/1/5/10 (B365), Internal connectors: 1x USB 3.0 Header (5

Listed since: 2021-05-04, RAID level: not available, USB nomenclature: Link, Wireless: not available, Socket: Intel 1151 v2, Lighting: not available, Warranty: three years (handlin, manufacturer: Biostar, Graphics: iGPU, Form factor: µATX, Buttons/Switches: not available, Multi-GPU: not available, Header Lighting: not available, Audio: 7.1 (Realtek ALC887), Header Cooling: 1x CPU fan 4-Pin, 2x, External connectors: 1x VGA (iGPU), 1x HD, CPU-Compatibility: Core i-9000, Core i-, RAM: 2x DDR4 DIMM, dual P, Chipset: Intel B360, Special features: All solid capacitors, Extension slots: 1x PCIe 3.0 x16, 11x, Internal connectors: 1x USB 3.0 Header (5, Power connections: 2x 24-Pin ATX, 1x 8-

Listed since: 2018-04-03, RAID level: not available, USB nomenclature: Link, Wireless: not available, Socket: Intel 1151 v2, manufacturer: MSI, Warranty: three years (from da, Graphics: iGPU, Form factor: µATX, Buttons/Switches: not available, Power connections: 1x 24-Pin ATX, 1x 8-, Multi-GPU: not available, Audio: 7.1 (Realtek ALC887), Header Cooling: 1x CPU fan 4-Pin, 2x, Extension slots: 1x PCIe 3.0 x16, 2x , Header Lighting: 1x 4-Pin RGB (+12V/G, Lighting: RGB, 1 zone (Audio T, CPU-Compatibility: Core i-9000, Core i-, RAM: 2x DDR4 DIMM, dual P, Special features: audio+solid capacito, External connectors: 1x DVI-D (iGPU), 1x , Chipset: Intel B360, Internal connectors: 1x USB 3.0 Header (5

Listed since: 2018-08-14, RAID level: not available, manufacturer: ASUS, USB nomenclature: Link, Chipset: Intel H310, Wireless: not available, Socket: Intel 1151 v2, Warranty: three years (handlin, Graphics: iGPU, Form factor: µATX, Buttons/Switches: not available, Header Cooling: 1x CPU fan 4-Pin, 1x, Multi-GPU: not available, Header Lighting: not available, Audio: 7.1 (Realtek ALC887), Power connections: 1x 24-Pin ATX, 1x 4-, Lighting: orange, 1 zone (Audi, CPU-Compatibility: Core i-9000, Core i-, RAM: 2x DDR4 DIMM, dual P, Internal connectors: 1x USB 3.0 Header (5, Special features: audio+solid capacito, Extension slots: 1x PCIe 3.0 x16, 2x , External connectors: 1x VGA (iGPU), 1x DV

Listed since: 2018-08-06, RAID level: not available, USB nomenclature: Link, Chipset: Intel H310, Wireless: not available, Socket: Intel 1151 v2, manufacturer: ASRock, Lighting: not available, Graphics: iGPU, Form factor: µATX, Buttons/Switches: not available, Power connections: 1x 24-Pin ATX, 1x 8-, Multi-GPU: not available, Header Lighting: not available, Extension slots: 1x PCIe 3.0 x16, 1x , Audio: 7.1 (Realtek ALC887), CPU-Compatibility: Core i-9000, Core i-, Internal connectors: 1x USB 3.0 Header (5, RAM: 2x DDR4 DIMM, dual P, Special features: audio+solid capacito, Header Cooling: 1x CPU fan 4-Pin, 1x, External connectors: 1x VGA (iGPU), 1x DV, Special features: audio+solid capacito, Form factor: µATX, Miscellaneous Interfaces: 4x SATA 6Gb/s (H310), Socket: Intel 1151 v2 (LGA11

Listed since: 2021-06-22, RAID level: not available, USB nomenclature: Link, Wireless: not available, Socket: Intel 1151 v2, Lighting: not available, Warranty: three years (handlin, manufacturer: Biostar, Graphics: iGPU, Form factor: µATX, Buttons/Switches: not available, Multi-GPU: not available, Header Lighting: not available, Audio: 7.1 (Realtek ALC887), Header Cooling: 1x CPU fan 4-Pin, 2x, CPU-Compatibility: Core i-9000, Core i-, RAM: 2x DDR4 DIMM, dual P, Chipset: Intel B360, Special features: All solid capacitors, Extension slots: 1x PCIe 3.0 x16, 11x, Power connections: 2x 24-Pin ATX, 1x 8-, External connectors: 1x VGA (iGPU), 1x HD, Internal connectors: 1x USB 3.0 Header (5

Listed since: 2019-12-13, USB nomenclature: Link, Wireless: not available, Socket: Intel 1151 v2, Lighting: not available, Warranty: three years (handlin, manufacturer: Biostar, Graphics: iGPU, Form factor: µATX, Buttons/Switches: not available, Header Cooling: 1x CPU fan 4-Pin, 1x, Multi-GPU: not available, Header Lighting: not available, Audio: 7.1 (Realtek ALC887), Power connections: 1x 24-Pin ATX, 1x 4-, Extension slots: 1x PCIe 3.0 x16, 2x , External connectors: 1x VGA (iGPU), 1x HD, CPU-Compatibility: Core i-9000, Core i-, RAM: 2x DDR4 DIMM, dual P, Chipset: Intel B365, RAID level: 0/1/5/10 (B365), Internal connectors: 1x USB 3.0 Header (5, Special features: All solid capacitors

Listed since: 2019-07-24, RAID level: not available, USB nomenclature: Link, Chipset: Intel H310, Wireless: not available, Socket: Intel 1151 v2, Lighting: not available, Warranty: three years (handlin, manufacturer: Biostar, Graphics: iGPU, Form factor: µATX, Buttons/Switches: not available, Header Cooling: 1x CPU fan 4-Pin, 1x, Multi-GPU: not available, Header Lighting: not available, Audio: 7.1 (Realtek ALC887), Power connections: 1x 24-Pin ATX, 1x 4-, Extension slots: 1x PCIe 3.0 x16, 2x , CPU-Compatibility: Core i-9000, Core i-, RAM: 2x DDR4 DIMM, dual P, Special features: audio+solid capacito, External connectors: 1x VGA (iGPU), 1x HD, Internal connectors: 1x USB 3.0 Header (5

Listed since: 2018-08-21, manufacturer: Supermicro, RAID level: not available, USB nomenclature: Link, Chipset: Intel H310, Wireless: not available, Socket: Intel 1151 v2, RAM: 2x DDR4 SO-DIMM, dua, Lighting: not available, Graphics: iGPU, Buttons/Switches: not available, Form factor: Mini-ITX, Power connections: 1x 24-Pin ATX, 1x 8-, Multi-GPU: not available, Header Lighting: not available, Header Cooling: 1x CPU fan 4-Pin, 2x, Audio: 7.1 (Realtek ALC888), CPU-Compatibility: Core i-9000, Core i-, Special features: All solid capacitors, External connectors: 1x DVI (iGPU), 1x HD, Internal connectors: 2x USB 2.0 header (4, Extension slots: 1x PCIe 3.0 x16, 1x

Listed since: 2018-10-15, RAID level: not available, manufacturer: ASUS, USB nomenclature: Link, Chipset: Intel H310, Wireless: not available, Socket: Intel 1151 v2, Warranty: three years (handlin, Graphics: iGPU, Form factor: µATX, Buttons/Switches: not available, Header Cooling: 1x CPU fan 4-Pin, 1x, Multi-GPU: not available, Header Lighting: not available, Audio: 7.1 (Realtek ALC887), Power connections: 1x 24-Pin ATX, 1x 4-, Lighting: orange, 1 zone (Audi, CPU-Compatibility: Core i-9000, Core i-, RAM: 2x DDR4 DIMM, dual P, Special features: audio+solid capacito, Extension slots: 1x PCIe 3.0 x16, 2x , Internal connectors: 1x USB 3.0 Header (5, External connectors: 1x VGA (iGPU), 1x HD

Listed since: 2018-11-21, manufacturer: Fujitsu, USB nomenclature: Link, Wireless: not available, Socket: Intel 1151 v2, Lighting: not available, Warranty: three years (handlin, Graphics: iGPU, Form factor: µATX, Buttons/Switches: not available, Multi-GPU: not available, Header Lighting: not available, Power connections: 1x 24-Pin ATX, 1x 4-, Header Cooling: 1x CPU fan 4-Pin, 2x, CPU-Compatibility: Core i-9000, Core i-, Chipset: Intel Q370, RAM: 4x DDR4 DIMM, dual P, RAID level: 0/1/5/10 (Q370), External connectors: 1x DVI-D (iGPU), 2x , Extension slots: 2x PCIe 3.0 x16 (1x , Special features: All solid capacitors, Internal connectors: 1x USB-A 3.1 socket,, Audio: 5.1 (Realtek ALC671)

Listed since: 2018-08-01, manufacturer: Supermicro, USB nomenclature: Link, Wireless: not available, Socket: Intel 1151 v2, Lighting: not available, Graphics: iGPU, Form factor: µATX, Buttons/Switches: not available, Multi-GPU: not available, Header Lighting: not available, Power connections: 1x 24-Pin ATX, 1x 8-, Audio: 7.1 (Realtek ALC888), CPU-Compatibility: Core i-9000, Core i-, Chipset: Intel Q370, RAM: 4x DDR4 DIMM, dual P, Extension slots: 1x PCIe 3.0 x16, 2x , RAID level: 0/1/5/10 (Q370), Header Cooling: 5x fan 4-Pin, Special features: All solid capacitors, Internal connectors: 1x USB-C 3.1 Key-A H, External connectors: 1x DVI (iGPU), 2x Di

Listed since: 2018-08-21, manufacturer: Supermicro, USB nomenclature: Link, Wireless: not available, Socket: Intel 1151 v2, RAM: 2x DDR4 SO-DIMM, dua, Lighting: not available, Graphics: iGPU, Buttons/Switches: not available, Form factor: Mini-ITX, Power connections: 1x 24-Pin ATX, 1x 8-, Multi-GPU: not available, Header Lighting: not available, Header Cooling: 1x CPU fan 4-Pin, 2x, Audio: 7.1 (Realtek ALC888), CPU-Compatibility: Core i-9000, Core i-, Chipset: Intel Q370, RAID level: 0/1/5/10 (Q370), Special features: All solid capacitors, Extension slots: 1x PCIe 3.0 x16, 1x , Internal connectors: 1x USB-C 3.1 Key-A H, External connectors: 1x DVI (iGPU), 1x HD

Listed since: 2018-08-21, manufacturer: Supermicro, RAID level: not available, USB nomenclature: Link, Chipset: Intel H310, Wireless: not available, Socket: Intel 1151 v2, RAM: 2x DDR4 SO-DIMM, dua, Lighting: not available, Graphics: iGPU, Buttons/Switches: not available, Form factor: Mini-ITX, Power connections: 1x 24-Pin ATX, 1x 8-, Multi-GPU: not available, Header Lighting: not available, Header Cooling: 1x CPU fan 4-Pin, 2x, Audio: 7.1 (Realtek ALC888), CPU-Compatibility: Core i-9000, Core i-, Special features: All solid capacitors, External connectors: 1x DVI (iGPU), 1x HD, Internal connectors: 2x USB 2.0 header (4, Extension slots: 1x PCIe 3.0 x16, 1x

RAID level: not available, manufacturer: GIGABYTE, USB nomenclature: Link, Chipset: Intel H310, Wireless: not available, Socket: Intel 1151 v2, Lighting: not available, Warranty: three years (from da, Graphics: iGPU, Form factor: µATX, Buttons/Switches: not available, Header Cooling: 1x CPU fan 4-Pin, 1x, Multi-GPU: not available, Header Lighting: not available, Audio: 7.1 (Realtek ALC887), Power connections: 1x 24-Pin ATX, 1x 4-, Extension slots: 1x PCIe 3.0 x16, 2x , External connectors: 1x VGA (iGPU), 1x HD, CPU-Compatibility: Core i-9000, Core i-, Listed since: 2018-04-02, Internal connectors: 1x USB 3.0 Header (5, RAM: 2x DDR4 DIMM, dual P, Special features: audio+solid capacito

Listed since: 2018-08-21, manufacturer: Supermicro, USB nomenclature: Link, Wireless: not available, Socket: Intel 1151 v2, RAM: 2x DDR4 SO-DIMM, dua, Lighting: not available, Graphics: iGPU, Buttons/Switches: not available, Form factor: Mini-ITX, Power connections: 1x 24-Pin ATX, 1x 8-, Multi-GPU: not available, Header Lighting: not available, Header Cooling: 1x CPU fan 4-Pin, 2x, Audio: 7.1 (Realtek ALC888), CPU-Compatibility: Core i-9000, Core i-, Chipset: Intel Q370, RAID level: 0/1/5/10 (Q370), Special features: All solid capacitors, Extension slots: 1x PCIe 3.0 x16, 1x , Internal connectors: 1x USB-C 3.1 Key-A H, External connectors: 1x DVI (iGPU), 1x HD

Listed since: 2018-09-17, manufacturer: Fujitsu, RAID level: not available, USB nomenclature: Link, Audio: 2.0 (Realtek ALC255), Chipset: Intel H310, Wireless: not available, Socket: Intel 1151 v2, RAM: 2x DDR4 SO-DIMM, dua, Lighting: not available, Warranty: three years (handlin, Graphics: iGPU, Buttons/Switches: not available, Header Cooling: 1x CPU fan 4-Pin, 1x, Multi-GPU: not available, Header Lighting: not available, Special features: All solid capacitors, Form factor: Thin Mini-ITX, CPU-Compatibility: Core i-9000, Core i-, Power connections: 1x DC In (19-24V), 1, Extension slots: 1x M.2/M-Key (PCIe 2, External connectors: 1x HDMI 1.4 (iGPU), , Internal connectors: 1x USB 3.0 Header (5

Listed since: 2018-08-21, manufacturer: Supermicro, RAID level: not available, USB nomenclature: Link, Chipset: Intel H310, Wireless: not available, Socket: Intel 1151 v2, Lighting: not available, Graphics: iGPU, Form factor: µATX, Buttons/Switches: not available, Power connections: 1x 24-Pin ATX, 1x 8-, Multi-GPU: not available, Header Lighting: not available, Header Cooling: 1x CPU fan 4-Pin, 3x, Special features: All solid capacitors, Audio: 7.1 (Realtek ALC888), CPU-Compatibility: Core i-9000, Core i-, RAM: 2x DDR4 DIMM, dual P, Internal connectors: 2x USB 2.0 header (4, External connectors: 1x DVI (iGPU), 1x HD, Extension slots: 1x PCIe 3.0 x16, 1x

Listed since: 2018-07-25, manufacturer: Supermicro, USB nomenclature: Link, Wireless: not available, Socket: Intel 1151 v2, Lighting: not available, Graphics: iGPU, Form factor: µATX, Buttons/Switches: not available, Power connections: 1x 24-Pin ATX, 1x 8-, Multi-GPU: not available, Header Lighting: not available, Header Cooling: 1x CPU fan 4-Pin, 3x, Audio: 7.1 (Realtek ALC888), CPU-Compatibility: Core i-9000, Core i-, Chipset: Intel Q370, RAM: 4x DDR4 DIMM, dual P, Extension slots: 1x PCIe 3.0 x16, 2x , RAID level: 0/1/5/10 (Q370), Special features: All solid capacitors, External connectors: 1x DVI (iGPU), 1x HD, Internal connectors: 2x USB 3.1 (20-Pin K

Listed since: 2018-11-16, RAID level: not available, manufacturer: GIGABYTE, USB nomenclature: Link, Chipset: Intel H310, Wireless: not available, Socket: Intel 1151 v2, Lighting: not available, Warranty: three years (from da, Graphics: iGPU, Form factor: µATX, Buttons/Switches: not available, Header Cooling: 1x CPU fan 4-Pin, 1x, Multi-GPU: not available, Header Lighting: not available, Audio: 7.1 (Realtek ALC887), Power connections: 1x 24-Pin ATX, 1x 4-, Extension slots: 1x PCIe 3.0 x16, 2x , External connectors: 1x VGA (iGPU), 1x HD, CPU-Compatibility: Core i-9000, Core i-, Internal connectors: 1x USB 3.0 Header (5, RAM: 2x DDR4 DIMM, dual P, Special features: audio+solid capacito

Listed since: 2020-11-20, USB nomenclature: Link, Wireless: not available, Socket: Intel 1151 v2, manufacturer: ASRock, Audio: 7.1 (Realtek ALC897), Lighting: not available, Graphics: iGPU, Form factor: µATX, Buttons/Switches: not available, Multi-GPU: AMD 2-Way-CrossFireX, Power connections: 1x 24-Pin ATX, 1x 8-, BIOS: 1x 16MB (128Mb), Header Lighting: not available, Extension slots: 1x PCIe 3.0 x16, 1x , CPU-Compatibility: Core i-9000, Core i-, Special features: audio+solid capacito, Header Cooling: 1x CPU fan 4-Pin, 1x, RAID level: 0/1/5/10 (H370), Chipset: Intel H370, RAM: 2x DDR4 DIMM, dual P, Internal connectors: 1x USB 3.0 Header (5, External connectors: 1x VGA (iGPU), 1x DV

Listed since: 2018-10-05, USB nomenclature: Link, Wireless: not available, Socket: Intel 1151 v2, manufacturer: MSI, Lighting: not available, Warranty: three years (from da, Graphics: iGPU, Audio: 7.1 (Realtek ALC892), Buttons/Switches: not available, Multi-GPU: AMD 2-Way-CrossFireX, RAM: 4x DDR4 DIMM, dual P, Form factor: ATX, Header Cooling: 1x CPU fan 4-Pin, 5x, Header Lighting: 1x 4-Pin RGB (+12V/G, CPU-Compatibility: Core i-9000, Core i-, Special features: audio+solid capacito, Power connections: 1x 24-Pin ATX, 1x 8-, RAID level: 0/1/5/10 (Z390), Chipset: Intel Z390, Extension slots: 2x PCIe 3.0 x16 (1x , Internal connectors: 2x USB 3.0 Header (5, External connectors: 1x VGA (iGPU), 1x DV

Listed since: 2018-04-03, RAID level: not available, manufacturer: ASUS, USB nomenclature: Link, Wireless: not available, Socket: Intel 1151 v2, Warranty: three years (handlin, Graphics: iGPU, Form factor: µATX, Buttons/Switches: not available, Power connections: 1x 24-Pin ATX, 1x 8-, Multi-GPU: not available, Audio: 7.1 (Realtek ALC887), Header Cooling: 1x CPU fan 4-Pin, 2x, Lighting: RGB, 1 zone (page ri, Header Lighting: 1x 4-Pin RGB (+12V/G, CPU-Compatibility: Core i-9000, Core i-, RAM: 4x DDR4 DIMM, dual P, Chipset: Intel B360, Special features: audio+solid capacito, Extension slots: 1x PCIe 3.0 x16, 2x , Internal connectors: 1x USB 3.0 Header (5, External connectors: 1x DVI-D (iGPU), 1x

Listed since: 2018-04-03, RAID level: not available, manufacturer: GIGABYTE, USB nomenclature: Link, Wireless: not available, Socket: Intel 1151 v2, Warranty: three years (from da, Graphics: iGPU, Form factor: µATX, Buttons/Switches: not available, Power connections: 1x 24-Pin ATX, 1x 8-, Header Cooling: 1x CPU fan 4-Pin, 1x, Multi-GPU: not available, Header Lighting: not available, Audio: 7.1 (Realtek ALC887), Extension slots: 1x PCIe 3.0 x16, 1x , CPU-Compatibility: Core i-9000, Core i-, RAM: 2x DDR4 DIMM, dual P, Chipset: Intel B360, Special features: audio+solid capacito, Lighting: red, 1 zone (Audio T, Internal connectors: 1x USB 3.0 Header (5, External connectors: 1x VGA (iGPU), 1x HD

Listed since: 2018-04-03, manufacturer: ASUS, USB nomenclature: Link, Wireless: not available, Socket: Intel 1151 v2, Lighting: not available, Warranty: three years (handlin, Graphics: iGPU, Form factor: µATX, Buttons/Switches: not available, Multi-GPU: AMD 2-Way-CrossFireX, Power connections: 1x 24-Pin ATX, 1x 8-, Header Lighting: not available, Audio: 7.1 (Realtek ALC887), CPU-Compatibility: Core i-9000, Core i-, RAM: 4x DDR4 DIMM, dual P, Special features: audio+solid capacito, Header Cooling: 1x CPU fan 4-Pin, 2x, Extension slots: 2x PCIe 3.0 x16 (1x , Internal connectors: 1x USB 3.0 Header (5, RAID level: 0/1/5/10 (H370), Chipset: Intel H370, External connectors: 1x VGA (iGPU), 1x DV

RAID level: not available, USB nomenclature: Link, Chipset: Intel H310, Wireless: not available, Socket: Intel 1151 v2, Audio: 7.1 (Realtek ALC897), Lighting: not available, Warranty: three years (handlin, manufacturer: Biostar, Graphics: iGPU, Form factor: µATX, Buttons/Switches: not available, Power connections: 1x 24-Pin ATX, 1x 8-, Header Cooling: 1x CPU fan 4-Pin, 1x, Multi-GPU: not available, Header Lighting: not available, Extension slots: 1x PCIe 3.0 x16, 2x , CPU-Compatibility: Core i-9000, Core i-, RAM: 2x DDR4 DIMM, dual P, Special features: All solid capacitors, Listed since: 2023-11-14, Internal connectors: 1x USB 3.0 Header (5, External connectors: 1x VGA (iGPU), 1x HD, Warranty: 3 years, Special features: All solid capacitors, Form factor: µATX, Miscellaneous Interfaces: 4x SATA 6Gb/s (H310), Socket: Intel 1151 v2 (LGA11

Listed since: 2018-04-04, RAID level: not available, Extension slots: 1x PCIe 3.0 x16, 1x , USB nomenclature: Link, Wireless: not available, Socket: Intel 1151 v2, manufacturer: ASRock, Lighting: not available, Graphics: iGPU, Buttons/Switches: not available, Form factor: Mini-ITX, Power connections: 1x 24-Pin ATX, 1x 8-, Multi-GPU: not available, Header Lighting: not available, Audio: 7.1 (Realtek ALC887), CPU-Compatibility: Core i-9000, Core i-, RAM: 2x DDR4 DIMM, dual P, Chipset: Intel B360, Special features: audio+solid capacito, Header Cooling: 1x CPU fan 4-Pin, 1x, Internal connectors: 1x USB 3.0 Header (5, External connectors: 1x DVI-I (iGPU), 1x

Listed since: 2019-05-03, manufacturer: ASUS, USB nomenclature: Link, Wireless: not available, Socket: Intel 1151 v2, Lighting: not available, Warranty: three years (handlin, Graphics: iGPU, Buttons/Switches: not available, Power connections: 1x 24-Pin ATX, 1x 8-, Multi-GPU: not available, Audio: 7.1 (Realtek ALC887), Form factor: ATX, Header Lighting: 2x 4-Pin RGB (+12V/G, Header Cooling: 1x CPU fan 4-Pin, 3x, CPU-Compatibility: Core i-9000, Core i-, RAM: 4x DDR4 DIMM, dual P, Special features: audio+solid capacito, Chipset: Intel B365, RAID level: 0/1/5/10 (B365), Extension slots: 2x PCIe 3.0 x16 (1x , External connectors: 1x VGA (iGPU), 1x DV, Internal connectors: 2x USB 3.0 Header (5